Aluminum oxide Al 2 O 3 ceramic substrate

Al 2 O 3 has become the most widely used ceramic substrate because of its relatively simple production process, low cost, and cheap price. Although its thermal conductivity is not high (20W/mK), it has become the most widely used ceramic substrate . Ceramic substrate, also known as ceramic substrate, is based on electronic ceramics, and forms a support base for membrane circuit components and external components. Ceramic substrates have the main advantages of high temperature resistance

Product Description

Al 2 O 3 has become the most widely used ceramic substrate because of its relatively simple production process, low cost, and cheap price. Although its thermal conductivity is not high (20W/mK), it has become the most widely used ceramic substrate . Ceramic substrate, also known as ceramic substrate, is based on electronic ceramics, and forms a support base for membrane circuit components and external components. Ceramic substrates have the main advantages of high temperature resistance, high electrical insulation performance, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficients to components. However, ceramic substrates are brittle and made The substrate area is small and the cost is high.

Commonly used ceramic substrate materials include Al 2 O 3 , AlN, SiC, BeO, BN, zirconia and glass ceramics.


Product parameters

Color: milky white

Size: within 100x100x1.0mm, can be cut according to customer requirements

Surface roughness: <0.01um (after polishing); <1um (rough)


Material properties

parameterunitA476T
densityg/ cm33.78
Hardness (HV)GPa13.9
Flexural strengthGPa380
Thermal conductivityW/mK26
Coefficient of thermal expansion 40~400°m/K7.2x10-6 _
Dielectric constant@1MHZ9.6
Dielectric loss angle@1MHZ3.0x10-4 _
volume resistivity@25℃Ohm.cm>10 14
@300℃Ohm.cm1.0x10 10
@500℃Ohm.cm1.0x10 8
Purity: 96%,96%,
sizeWithin 100x100x1.0mm, can be customized
Surface roughness<0.01um (after polishing); <1um (rough)



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